|
|
Surface Mount Technology
-
Large pin count BGA packages
-
BGA reball and repair
-
uBGA (~.4mm pitch)
-
Leaded devices (~.4mm pitch)
-
Leadless devices
-
Miniature Chip (~01005)
-
All assemblies receive custom thermal profiles
-
Laser cut / custom designed solder stencils
With our cutting edge Fuji line configuration we have both flexibility for a high mix environment, as well as scalability for ramping up larger production runs.
Since many companies now realizing the real costs associated with offshore outsourcing, Kodiak has created a cost effective alternative for both prototyping and large scale production.
|
|
|
|
|